LD-MK-UV3003 Diode end-pumped UV Laser Marking Machine

Applied materials: Brittleness material like fire-proof material, glass, ceramics, monocrystalline

silicon and polycrystalline silicon etc. Special material like small Flexible Printed Circuit etc

Applied Industries: It can be applied for precision marking, micro-processing and cold

processing in micro-electronics industry. Marking, scribing, carving, cutting and surface

processing on various type of chips, flexible printed circuit board, ultra-thin glass, LCD screen,

textile, sheet ceramic, semiconductor wafer, IC grain, sapphire, polymeric film, brittleness

material and Special plastic packaging etc.

Features :

1. Adopt high quality UV laser source, wave length is 355nm

2. Compare with normal laser marking machine, the focused spot of UV laser is smaller and

marking result is better precision. It has incomparable advantage than other laser machines for

applied precision marking, precision cutting and micro processing on the special materials.

3. It suitable for precision micro machining, cold processing. Compare with infrared diode

pumped machine, it has higher absorption rate of metal, monocrystalline silicon, polycrystalline

silicon, industrial ceramics, glass etc, can used for marking, cutting, scribing and cutting for small

Flexible Printed Circuit.

Parameter:

Laser Medium  ND:YVO4

Laser wavelength  355nm

Average Output Power  ≥3W@30KHZ

Power Supply  AC220V±15% 50Hz